Project goals
- Building electronic environment for product lifecycle management and development;
- Improving the efficiency of designing complex functional products.
Project deadlines
May 2020 – July 2020
Project summary
Here are the task the complex information environment was deployed to solve:
- Mechanical design;
- Design in the context of additive manufacturing;
- Pipeline systems design;
- Development of NC programs;
- Preparing for additive manufacturing;
- Printed circuit board design (EDA);
- Printed circuit board modeling (EDA);
- Calculation of printed circuit board cooling;
- Structural analysis (SA);
- Heat transfer calculations;
- Performing gas-hydrodynamic calculations;
- Product data management, including editing, viewing, advanced visualization, formation and maintenance of the structure of master data, as well as a description of material properties, dynamic search for master data, management and implementation of changes;
- 1D (functional) modeling;
- Multiphysics simulation;
- Electrical systems modeling;
- Batteries and fuel cells modeling;
- Steady and unsteady fluid flow modeling;
- Simulation of steady and unsteady temperature fields and heat transfer.
Project results
- The developed complex of applied software products makes it possible to perform all the tasks of engineering analysis, mathematical modeling, provides the creation of digital twins of complex products;
- Significant reduction in the volume of physical and natural tests, reduction of time, financial and other resource costs.
Chapter
Solution
Platform